What Is Difference Between Sputtering Coating And Magnetron Sputtering Coating

What Is Difference Between Sputtering Coating And Magnetron Sputtering Coating

Sputtering coating is a technique used to deposit thin films of material onto a substrate by bombarding the target material with high-energy ions. In this process, the target material is first placed in a vacuum chamber, and then ions are accelerated towards it using an electric field. These ions collide with the target material and knock off atoms, which then travel to the substrate and deposit on it to form a thin film.

Magnetron sputtering coating is a type of sputtering coating that uses a magnetic field to increase the efficiency and rate of the process. In this technique, a magnetron is used to generate a magnetic field that traps electrons near the target material, causing it to ionize more efficiently and leading to a higher deposition rate.

The main difference between sputtering coating and magnetron sputtering coating is the use of a magnetic field in the latter process. Magnetron sputtering coating offers several advantages over regular sputtering coating, such as higher deposition rates, improved film adhesion, and more precise control over the film thickness. Additionally, magnetron sputtering coating is capable of depositing a wider range of materials, including high-melting-point metals and ceramics(650MH), which may not be possible with regular sputtering coating.