What is difference between ion sputtering coating & Magnetron sputtering

Sputtering is a widely used physical vapor deposition (PVD) technique for thin film deposition. It involves the ejection of atoms from a solid target material by bombarding it with energetic particles, typically ions or electrons. The ejected atoms condense onto a substrate to form a thin film. There are various types of sputtering techniques, including ion sputtering and magnetron sputtering. While both techniques are based on the same fundamental principles, there are significant differences between them in terms of the process parameters, equipment design, and resulting film properties. In this article, we will compare and contrast the ion sputtering coating technique and magnetron sputtering coating technique, highlighting their advantages and disadvantages.

Ion Sputtering Coating Technique

Ion sputtering is a type of sputtering that uses ions as the bombarding particles. The ions are accelerated to high energies and directed towards a target material. When the ions collide with the target, they transfer their kinetic energy to the target atoms, causing them to be ejected from the surface. The ejected atoms then travel in a straight line and deposit onto a substrate, forming a thin film.

Ion sputtering has several advantages over other sputtering techniques, including high deposition rates, good film uniformity, and low substrate heating. It is also a highly directional process, meaning that the film thickness can be controlled by adjusting the angle of incidence of the ions. However, ion sputtering requires a high vacuum environment to avoid gas scattering, which can reduce the deposition rate and film quality. The high energy of the ions can also cause damage to the target material, resulting in poor film adhesion and increased defect density.

Magnetron Sputtering Coating Technique

Magnetron sputtering is a type of sputtering that uses a magnetic field to confine the plasma and increase the ionization efficiency. The magnetic field is created by a set of permanent magnets or an electromagnet, which traps the electrons and ions near the target surface, increasing their density and collision frequency. The increased ionization efficiency leads to a higher deposition rate and better film quality compared to conventional ion sputtering.

Magnetron sputtering has several advantages over other sputtering techniques, including high deposition rates, good film uniformity, and low substrate heating. It also has a lower ion energy compared to ion sputtering, which reduces the risk of damage to the target material and improves the film adhesion. The magnetic field also promotes a more isotropic deposition, allowing for better coverage of complex shapes and patterns. However, magnetron sputtering requires a more complex equipment design and higher power consumption compared to ion sputtering.